Component Mounting Method for Printed Circuit Boards (PCBs)

• - Applied technology that enables more stable mounting of components on PCBs, enhancing the reliability of electronic component assembly processes.
• - This patented method simplifies PCB assembly by combining SMT and through-hole component soldering through sequential high- and low-temperature reflow processes. It enhances lead bonding strength and streamlines the overall manufacturing workflow.

Lead-Free Solder for Mounting Electronic Components

• - An environmentally friendly lead-free solder technology designed to reduce the harmful effects of traditional soldering processes, complying with international environmental regulations (REACH/RoHS).
• - This technology uses a combination of low- and high-melting-point alloy powders to produce lead-free solder that enables temperature control and consolidates two soldering steps into one. It enhances process efficiency, reduces bonding temperature, and improves yield.

Solder Cream for Electronic Parts

• - Developed a solder cream composition technology that ensures optimal soldering performance during the electronic component mounting process.
• - This solder cream features a Bi-Zn-Sn alloy optimized for low-temperature soldering. It simplifies the process and improves productivity in electronic component manufacturing by enabling efficient soldering at lower temperatures.

Solder Cream for Electronic Parts and Its Manufacturing Method

• - Introduced a new manufacturing method that maximizes oxidation prevention, stability, and printing precision compared to conventional solder creams.
• - This patent covers a solder cream composed of Bi, Cu, and Co alloy powder blended with flux. The formulation improves work efficiency by simplifying the soldering process through effective cream formation.