There are many types of solder pastes with various properties that meet the needs of customers.

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KR

031-673-0019

ⓒ AH KOREA

PRODUCTS Solder paste

게시물 검색

31

High bonding strength NP406-MGM555-GK

Solder a..

Sn-3.5Ag-6In-0.5Bi

Melting ..

196 - 206

Particle..

45 ~ 20

Halogen ..

≤0.010%
30

High bonding strength PW231-ST355-GQ-CC-1

Solder a..

Sn-1.0Ag-3.0Bi-0.5Cu

Melting ..

207 - 223

Particle..

Type 4

Halogen ..

0.14wt% ±0.05
29

High bonding strength SAB433-COSMO-ZQ-C

Solder a..

Sn-4.0Ag-3.3Sb-2.0Bi-1..

Melting ..

209 - 233

Particle..

38 ~ 20

Halogen ..

0.08wt% ±0.02
28

Jet Dispense Windot-F005-NP303

Solder a..

Sn-3.0Ag-0.5Cu | Sn-58..

Particle..

Type 5, 6, 7

Halogen ..

≤ 0.03 wt%
27

Low Residue NP303 – FLV – T4

Solder a..

Sn - 3.0Ag - 0.5Cu

Melting ..

217~219

Particle..

Type 4

Halogen ..

0.3wt% ±0.05
26

Low Residue NP303 – FL001 – T4

Solder a..

Sn - 3.0Ag - 0.5Cu

Melting ..

217~219

Particle..

Type 4

Halogen ..

≤ 0.01 wt%
25

Low Temperature SB6 – HLGQ - MSD

Solder a..

Sn-57Bi-0.4Ag

Melting ..

139 ~ 141

Particle..

38~20

Halogen ..

Cl: ≤700 ppm, Br: ≤700..
24

Low Temperature NP601-SZ355-GK-1

Solder a..

Sn - 8.0Zn - 3.0Bi

Melting ..

187～196

Particle..

45～20

Halogen ..

0.015±0.015
23

Low Temperature ASB – HLGQ - HV

Solder a..

Sn-57 Bi-0.1Cu-0.02Co

Melting ..

139 ~ 141

Particle..

38~20

Halogen ..

Cl: ≤700 ppm, Br: ≤700..
22

Low Void NP303 – VLP102 – T4

Solder a..

Sn - 3.0Ag - 0.5Cu

Melting ..

217~219

Particle..

Type 4

Halogen ..

0.07±0.05wt%
21

General Use PW233 – LHGQ – 7KR

Solder a..

Sn – 3.0Bi - 0.3Ag - 0..

Melting ..

207~224

Particle..

38~20

Halogen ..

Cl: ≤700 ppm, Br: ≤700..
20

General Use NP303-COSMO-LH-T5

Solder a..

Sn - 3.0Ag - 0.5Cu

Melting ..

217~219

Particle..

25~10

Halogen ..

Cl: ≤700 ppm, Br: ≤700..
19

General Use NP303-COSMO-LH-T4

Solder a..

Sn - 3.0Ag - 0.5Cu

Melting ..

217~219

Particle..

38~20

Halogen ..

Cl: ≤700 ppm, Br: ≤700..
18

General Use NP110 – COSMO - LH - T45

Solder a..

Sn - 1.1Ag - 0.7Cu

Melting ..

217~224

Particle..

32~20

Halogen ..

Cl: ≤700 ppm, Br: ≤700..
17

General Use NP103 – LHGQ – 7KR

Solder a..

Sn – 0.3Ag - 0.7Cu

Melting ..

217~227

Particle..

38~20

Halogen ..

Cl: ≤700 ppm, Br: ≤700..
16

Epoxy SB58 – EPP101 – T4

Solder p..

Printing

Solder a..

Sn-58Bi

Reflow C..

Air Reflow

Particle..

Type 4

Halogen ..

0.05 wt%

031-673-0019