PRODUCTS Solder paste

Low Temperature ASB – HLGQ - HV

작성자최고관리자

  • 등록일 25-04-23
  • 조회17회
Solder alloy
Sn-57 Bi-0.1Cu-0.02Co
Melting point (℃)
139 ~ 141
Particle size (μm)
38~20
Halogen Content (ppm)
Cl: ≤700 ppm, Br: ≤700 ppm

본문

Characteristic

 It is a bismuth-based low melting point alternative.

・ This is a halogen-free product.