Low Temperature NP601-SZ355-GK-1
작성자최고관리자
- 등록일 25-04-23
- 조회15회
- Solder alloy
- Sn - 8.0Zn - 3.0Bi
- Melting point (℃)
- 187~196
- Particle size (μm)
- 45~20
- Halogen Content (%)
- 0.015±0.015
본문
Features
・This solder paste is fit to use printing by multi spot dispensing.
・This Sn-Zn-Bi solder paste can use on air re-flow.
・Excellent printability performance because of new developed flux.
・There is scarcely tiny solder ball after long time continuous printing.
・It can be supported with a low-viscosity product for dispensing.