PRODUCTS Solder paste

Low Temperature NP601-SZ355-GK-1

작성자최고관리자

  • 등록일 25-04-23
  • 조회15회
Solder alloy
Sn - 8.0Zn - 3.0Bi
Melting point (℃)
187~196
Particle size (μm)
45~20
Halogen Content (%)
0.015±0.015

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Features

This solder paste is fit to use printing by multi spot dispensing.

This Sn-Zn-Bi solder paste can use on air re-flow.

Excellent printability performance because of new developed flux.

There is scarcely tiny solder ball after long time continuous printing.

It can be supported with a low-viscosity product for dispensing.