PRODUCTS Solder paste

Low Temperature SB6 – HLGQ - MSD

작성자최고관리자

  • 등록일 25-04-23
  • 조회15회
Solder alloy
Sn-57Bi-0.4Ag
Melting point (℃)
139 ~ 141
Particle size (μm)
38~20
Halogen Content (ppm)
Cl: ≤700 ppm, Br: ≤700 ppm

본문

Characteristic

・ It is a bismuth-based low melting point alternative.

・ It can be supported with a low-viscosity product for dispensing.

・ This is a halogen-free product.