Solder Paste

Type		Products	Alloys	Features
General Use		NP303-COSMO-T4/T5	Sn - 3.0Ag - 0.5Cu	Room temperature storable solder paste
		NP110-COSMO-LH-T45	Sn - 1.1Ag - 0.7Cu	Low-cost type, TV main board use
		NP103-LHGQ-7KR	Sn - 0.3Ag - 0.7Cu	Low-cost type
		PW233-LHGQ-7KR	Sn - 3Bi - 0.3Ag - 0.5Cu	Low-cost, High strength
Low Temperature		NP601-SZ355-GK-1	Sn - 8.0Zn - 3.0Bi	Melting point : 187 – 196°C
		SB6-HLGQ-MSD	Sn - 57Bi - 0.4Ag	Melting point : 139 – 141°C
		ASB-HLGQ-HV	Sn - 57Bi - 0.1Cu - 0.02Co
Void Free		NP303-VLP102-T4	Sn - 3.0Ag - 0.5Cu	Void rate: 3%, Low-voiding product
Water Soluble		NP303-WS6104-T6/T7	Sn - 3.0Ag - 0.5Cu	TYPE6 & 7 compatible, Slump same as standard
Dispense	Air Dispense	NP303-DPS101-T4/T5	Sn - 3.0Ag - 0.5Cu	Excellent continuous dispensing
		NP303-DPS501-T4/T5	Sn - 3.0Ag - 0.5Cu	Suppresses solder balls during laser soldering
	Jet Dispense	winDot-F005-NP303	Sn - 3.0Ag - 0.5Cu	Jet dispensing solder paste (400 dot/sec), Fine dotting & meltability Compatible with Sn-3.0Ag-0.5Cu / Sn-58Bi / Sn-10Sb
Fine Solder Powder		NP303-SFP101-T6/T7	Sn - 3.0Ag - 0.5Cu	Mini/Micro LED optimized, Printing stability focused
		NP303-DPF201-T6/T7	Sn - 3.0Ag - 0.5Cu	For dispenser, Fine-size dotting capable
		NP303-UFP501-T8/T9	Sn - 3.0Ag - 0.5Cu	Type 8 & Type 9 fine powder solder paste for printing applications
		NP303-DPF201-T8/T9	Sn - 3.0Ag - 0.5Cu	Type 8 & Type 9 fine powder solder paste for dispensing applications
		NP303-GOP501-T6/T7/T9	Sn - 3.0Ag - 0.5Cu	Fine powder solder paste for gravure offset printing
Epoxy		SB58-EPP101-T4	Sn - 58Bi	Low melting, Prevents epoxy contamination of optical parts
		SB58-EPC101-T4	Sn - 58Bi	Low melting epoxy-based paste for dispenser
		NP303-EPP101-T4	Sn - 3.0Ag - 0.5Cu	Prevents contamination of optical parts by epoxy resin
		NP303-EPC101-T4	Sn - 3.0Ag - 0.5Cu	Epoxy-based paste for dispenser
Low Residue		NP303-FL001-T4	Sn - 3.0Ag - 0.5Cu	Formic acid reflow compatible
		NP303-FLV-T4	Sn - 3.0Ag - 0.5Cu	Residue-less solder paste with minimal flux residue after reflow

Solder Wire

Type		Products	Alloys
General Use		DHB-RMA3 NP303	Sn - 3.0Ag - 0.5Cu
		YH-5 NP303	Sn - 3.0Ag - 0.5Cu
Low Cost		ALF1-S4	Sn - 0.7Cu
		AHF2-S3	Sn - 0.3Ag - 0.5Cu
		AHF2-S4	Sn - 0.7Cu
		AHF5-S4	Sn - 0.7Cu

Solder Bar

Products	Alloys	Features
AHS4-B20	Sn - 0.7Cu	For General Wave Soldering

Flux

Products	Solid Content(%)	Features
AHF-610NC	2.3	Ultra-Low Rosin Flux for Sensor Plating Applications
ALHF-10-1	10	General-Purpose Rosin-Based Flux (For Wave and Dip Soldering)
	7.5
ALHF-3	3.3	Flux for Component Soldering
AHK-LF-5	5	Rosin-Based Flux
AHK-LF-12	12	Rosin-Based Flux

Thinner

Products	Specific Gravity	Features
AHS-1000	0.786	For Adjusting Flux Specific Gravity and General Component Cleaning