Low Void NP303 – VLP102 – T4
작성자최고관리자
- 등록일 25-04-23
- 조회16회
- Solder alloy
- Sn - 3.0Ag - 0.5Cu
- Melting point (℃)
- 217~219
- Particle size (Type)
- Type 4
- Halogen Content (wt%)
- 0.07±0.05wt%
본문
Features
・ It is a void suppression product with SAC305 solder composition.
・It suppresses void formation by promoting internal gas release during melting.
・Reduction of components prone to gas generation within the flux.
