General Use PW233 – LHGQ – 7KR
작성자최고관리자
- 등록일 25-04-23
- 조회1,084회
- Solder alloy
- Sn – 3.0Bi - 0.3Ag - 0.5Cu
- Melting point (℃)
- 207~224
- Particle size (μm)
- 38~20
- Halogen Content(ppm)
- Cl: ≤700 ppm, Br: ≤700 ppm
본문
Characteristic
・ PW233 is lower than Sn-3Ag-0.5Cu on metal cost.
・ Even under high temperature and high humidity conditions, PW233-LHGQ-7KR shows minimal viscosity change during continuous use.
・ When replenishing the cream during printing, there is no deterioration in performance even after 7 days of use.
・ PW233-LHGQ-7KR has improved chip-side ball formation.
・ This is a halogen-free product.