PRODUCTS Solder paste

High bonding strength SAB433-COSMO-ZQ-C

작성자관리자

  • 등록일 25-05-21
  • 조회1회
Solder alloy
Sn-4.0Ag-3.3Sb-2.0Bi-1.0Cu-Ni-Ge
Melting point (℃)
209 - 233
Particle size (μm)
38 ~ 20
Halogen Content (wt%)
0.08wt% ±0.02

본문

Features

・ The addition of Bi and Sb suppresses crack initiation and propagation, enhancing joint durability and reliability.

・ The synergistic effect of the alloying elements ensures excellent joint reliability while maintaining melting characteristics comparable to SAC305.

・ Demonstrates minimal property degradation during storage and transportation at room temperature, offering improved stability over conventional products.