High bonding strength SAB433-COSMO-ZQ-C
작성자관리자
- 등록일 25-05-21
- 조회1회
- Solder alloy
- Sn-4.0Ag-3.3Sb-2.0Bi-1.0Cu-Ni-Ge
- Melting point (℃)
- 209 - 233
- Particle size (μm)
- 38 ~ 20
- Halogen Content (wt%)
- 0.08wt% ±0.02
본문
Features
・ The addition of Bi and Sb suppresses crack initiation and propagation, enhancing joint durability and reliability.
・ The synergistic effect of the alloying elements ensures excellent joint reliability while maintaining melting characteristics comparable to SAC305.
・ Demonstrates minimal property degradation during storage and transportation at room temperature, offering improved stability over conventional products.