High bonding strength PW231-ST355-GQ-CC-1
작성자관리자
- 등록일 25-05-21
- 조회1회
- Solder alloy
- Sn-1.0Ag-3.0Bi-0.5Cu
- Melting point (℃)
- 207 - 223
- Particle size (μm)
- Type 4
- Halogen Content (wt%)
- 0.14wt% ±0.05
본문
Features
・ A low-Ag solder alloy with higher strength and superior thermal shock resistance compared to SAC305 (Sn-3Ag-0.5Cu).
・ Designed with reduced silver content for significant cost savings. Offers excellent stability with minimal performance degradation during ambient temperature storage and transportation, making it easy to handle.
・ Prevents BGA non-wet (non-melting) defects.