High bonding strength NP406-MGM555-GK
작성자관리자
- 등록일 25-05-21
- 조회3회
- Solder alloy
- Sn-3.5Ag-6In-0.5Bi
- Melting point (℃)
- 196 - 206
- Particle size (μm)
- 45 ~ 20
- Halogen Content(%)
- ≤0.010%
본문
Features
・ Improved version of chip side ball performance.
・ Solder alloy with superior heat resistance compared to SAC305 composition.