Jet Dispense Windot-F005-NP303
작성자최고관리자
- 등록일 25-04-23
- 조회22회
- Solder alloy
- Sn-3.0Ag-0.5Cu | Sn-58Bi | Sn-10Sb
- Particle size (Type)
- Type 5, 6, 7
- Halogen Content (wt%)
- ≤ 0.03 wt%
본문
Features
・This solder paste is designed for jet dispensing, enabling high-speed and ultra-fine dotting.
・Optimized for dispensing on components with complex or 3D structures where traditional printing is not possible.
