Low Residue NP303 – FLV – T4
작성자최고관리자
- 등록일 25-04-23
- 조회17회
- Solder alloy
- Sn - 3.0Ag - 0.5Cu
- Melting point (℃)
- 217~219
- Particle size (Type)
- Type 4
- Halogen Content (wt%)
- 0.3wt% ±0.05
본문
Features
・This is a no-residue solder paste that leaves minimal flux residue after reflow.
・Exhibits excellent wettability even on substrates with poor solderability, such as nickel.
