Fine Solder Powder NP303 – GOP501 – T9
작성자최고관리자
- 등록일 25-04-23
- 조회12회
- Solder alloy
- Sn - 3.0Ag - 0.5Cu
- Melting point (℃)
- 217~219
- Particle size (Type)
- Type 9
- Halogen Content (wt%)
- ≤0.1wt%
본문
Features
・This product is suitable for soldering ultra-fine size components.
・Solder paste for gravure offset printing.
