Fine Solder Powder NP303 – SFP101 – T7
작성자최고관리자
- 등록일 25-04-23
- 조회13회
- Solder alloy
- Sn - 3.0Ag - 0.5Cu
- Melting point (℃)
- 217~219
- Particle size(Type)
- Type 7
- Halogen Content (wt%)
- ≤0.05wt%
본문
Features
・ This product is designed to ensure stable printing performance for Mini LED mounting on display substrates.
・ Optimized viscosity and thixotropy improve printability by enabling uniform solder deposition.
