Water Soluble NP303 – WS6104 – T6
작성자최고관리자
- 등록일 25-04-23
- 조회17회
- Solder alloy
- Sn - 3.0Ag - 0.5Cu
- Melting point (℃)
- 217~219
- Particle size (Type)
- Type 6, 7
- Halogen Content (wt%)
- ≤0.05wt%
본문
Features
・It supports up to Type 7 for miniaturization of semiconductor package mounting.
・It has achieved excellent cleanability, fine printing, meltability, and void performance.
