Air Dispense NP303 – DPS501 – T4
작성자최고관리자
- 등록일 25-04-23
- 조회12회
- Solder alloy
- Sn - 3.0Ag - 0.5Cu
- Melting point (℃)
- 217~219
- Particle size (Type)
- Type 4
- Halogen Content (wt%)
- ≤0.35wt%
본문
Features
・ This is a solder paste designed for air dispensing systems.
・ Prevents solder ball formation caused by laser heating.
