Epoxy NP303 – EPC101 – T4
작성자최고관리자
- 등록일 25-04-23
- 조회16회
- Solder paste supply
- Printing
- Solder alloy
- Sn-3.0Ag-0.5Cu
- Reflow Condition
- Air Reflow (After T5, it requires nitrogen reflow)
- Particle size (Type)
- Type 4, 5, 6
- Halogen Content (wt%)
- ≤0.05wt%
본문
Characteristic
・It is an epoxy resin-based paste with an SAC305 composition.
・It has printing stability with no significant changes for up to 8 hours of continuous printing.
・It has higher shear strength compared to conventional rosin-based flux paste and shows less degradation after thermal shock testing.
