Epoxy SB58 – EPC101 – T4
작성자최고관리자
- 등록일 25-04-23
- 조회12회
- Solder paste supply method
- Dispense
- Solder alloy
- Sn-58Bi
- Reflow Condition
- Air Reflow
- Particle size (Type)
- Type 4
- Halogen Content (wt%)
- 0.05wt%
본문
Characteristic
・It is a low melting point epoxy resin-based paste.
・It has printing stability with no significant changes for up to 8 hours of continuous printing.
・It has higher shear strength compared to conventional rosin-based flux paste and shows less degradation after thermal shock testing.
・It has no cracks and prevents contamination of optical components such as lenses due to the epoxy resin.