PRODUCTS Solder paste

Epoxy SB58 – EPC101 – T4

작성자최고관리자

  • 등록일 25-04-23
  • 조회12회
Solder paste supply method
Dispense
Solder alloy
Sn-58Bi
Reflow Condition
Air Reflow
Particle size (Type)
Type 4
Halogen Content (wt%)
0.05wt%

본문

Characteristic

It is a low melting point epoxy resin-based paste.

It has printing stability with no significant changes for up to 8 hours of continuous printing.

It has higher shear strength compared to conventional rosin-based flux paste and shows less degradation after thermal shock testing.

It has no cracks and prevents contamination of optical components such as lenses due to the epoxy resin.


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