Low Residue NP303 – FL001 – T4
작성자최고관리자
- 등록일 25-04-23
- 조회18회
- Solder alloy
- Sn - 3.0Ag - 0.5Cu
- Melting point (℃)
- 217~219
- Particle size (Type)
- Type 4
- Halogen Content (wt%)
- ≤ 0.01 wt%
본문
Features
・This is a no-residue solder paste designed for formic acid reflow processes.
・Leaves no flux residue, requires no cleaning, and ensures void-free results.
