AHF2 – S3
작성자최고관리자
- 등록일 25-04-23
- 조회6회
- Chemical composition
- Sn – 0.3 Ag - 0.5Cu
- Melting point (℃)
- 217 ~ 227
- Tensile Strength (MPa)
- 31.4
- Elongation (%)
- 49
- Halogen content (wt%)
- 0.07 MAX or less
본문
Characteristic
・It has fast initial wetting and excellent wettability.
・Spattering of flux and solder particles have been remarkably reduced.