AHF5 – S4
작성자최고관리자
- 등록일 25-04-23
- 조회6회
- Chemical composition
- Sn – 0.7Cu
- Melting point (℃)
- 227
- Tensile Strength (MPa)
- 22.9
- Elongation (%)
- 29
- Halogen content (wt%）
- 0.07 MAX or less
본문
Characteristic
・It has fast initial wetting and excellent wettability.
・Spattering of flux and solder particles have been remarkably reduced.