PRODUCTS Solder wire

DHB-RMA3 NP303

작성자최고관리자

  • 등록일 25-04-23
  • 조회9회
Chemical composition
Sn – 0.3 Ag - 0.5Cu
Melting point (℃)
217 ~ 219
Halogen content (wt%)
0.07wt%±0.03

본문

Characteristic

It has fast initial wetting and excellent wettability.

Spattering of flux and solder particles have been remarkably reduced.

It exhibits excellent solderability even on substrates that are difficult to solder, such as nickel (Ni), due to its superior wettability.