DHB-RMA3 NP303
작성자최고관리자
- 등록일 25-04-23
- 조회9회
- Chemical composition
- Sn – 0.3 Ag - 0.5Cu
- Melting point (℃)
- 217 ~ 219
- Halogen content (wt%)
- 0.07wt%±0.03
본문
Characteristic
・It has fast initial wetting and excellent wettability.
・Spattering of flux and solder particles have been remarkably reduced.
・It exhibits excellent solderability even on substrates that are difficult to solder, such as nickel (Ni), due to its superior wettability.