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Key Features

Void Rate Below 10%
Achieves ultra-low voiding through flux formulation that suppresses and releases gas generation.

Excellent Wettability
Efficient gas release from solder during melting helps reduce void formation.

Minimized Volatile Components
Reduces gas-generating elements to ensure stable joint quality during reflow.

Outstanding Reflow Profile Compatibility
Maintains consistent quality under both upper and lower temperature ranges, ensuring high process flexibility.

VLP102 is suitable for BGA mounting processes and meets the stringent void suppression requirements of high-reliability applications, including automotive electronics SMT production lines.

[Product brochure available for download below]